Die attach method and microarray leadframe structu

专利名称：Die attach method and microarray

leadframe structure

发明人：Jaime A. Bayan,Nghia Thuc Tu,Lim Fong,Chan

Peng Yeen

申请号：US11372481申请日：20060308公开号：US07598122B1公开日：20091006

专利附图：

摘要：In one aspect of the invention, a method of attaching a semiconductor die to amicroarray leadframe is described. The method comprises stamping an adhesive onto

discrete areas of the microarray leadframe using a multi-pronged stamp tool. Theadhesive is applied to the leadframe as a series of dots, each dot corresponding to anassociated prong of the stamping tool. In some embodiments the adhesive used toattach the semiconductor die to a leadframe is a black epoxy based adhesive material. Inan apparatus aspect of the invention, lead traces in a microarray leadframe are arrangedto have tails that extend beyond their associated contact posts on the side of the contactpost that is opposite a wire bonding region such that such lead traces extends on twoopposing sides of their associated contact posts. The tails do not attach to otherstructures within the lead frame (such as a die attach structure). The width of at leastsome of these tailed lead traces in a region that overlies their associated contact post isnarrower than their associated contact post. Thus, these narrowed lead traces haveextensions that extend beyond their associated contact posts. The extensions provideadditional surface area that gives an adhesive applied to the narrowed lead trace (as forexample by stamping) room to bleed (flow) along the top surface of the lead trace onboth sides of the associated contact pad.

申请人：Jaime A. Bayan,Nghia Thuc Tu,Lim Fong,Chan Peng Yeen

地址：Palo Alto CA US,San Jose CA US,Ayer Keroh MY,Taman Malim Jaya MY

国籍：US,US,MY,MY

代理机构：Beyer Law Group LLP

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